Product Description

Shin-etsu Microsi Silicone Heatsink/processor Thermal Compound Paste Syringe -

 

1. Excellent thermal resistance (TR) and thermal conductivity (TC)Excellent thermal resistance (TR) and thermal conductivity (TC)

2. Low viscosity at the time of application, easily applied via dispensing, stencil printing, or screen printing methods

3. Table homogeneous mixture for consistent thermal performance RoHS and REACH Compliant

4. High volume production product from a proven industry leader Available worldwide through established supply chain networks
5. X23- 7783D thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability